Wednesday, January 18th, 2017

 At the 2011 3-D Architectures for Semiconductor Integration and Packaging Conference held in San Mateo, CA this month, speaker after speaker made it pretty apparent that 3D is for real. Though there are still competing flavors of 3D, and some advocate ‘2.5D’ as a safe stepping stone, the cost and reliability of 3D are now [...]

 December 1,2011, Printed Electronics USA 2011, Santa Clara, CA—Joshua Windmiller from UC San Diego illustrated their efforts in wearable printed sensors. As electronics and sensors continue their progression of shrinking and adding new capabilities, eventually a full laboratory will be reduced to the size of a postage stamp. This reduction will allow sensors to be [...]

 December 1,2011, Printed Electronics USA 2011, Santa Clara, CA—Warren Jackson from HP talked about fabricating large area metal oxide thin film transistors (MOTFT) using roll-to-roll imprint lithography. These developments can be applied to many areas including displays, packaging, and civil and military functions. MOTFTs offer many advantages over amorphous silicon and poly-silicon. A-Si has low [...]

 December 1,2011, Printed Electronics USA 2011, Santa Clara, CA—Mykyong Yoo from Artificial Muscle discussed electro active polymer (EAP) technology. This technology converts an applied voltage to displacement. Contacts on opposite sides of a polymer use Maxwellian pressure to thin and expand the polymer. Stroke distance is proportional to the dielectric constant, voltage squared, and Young’s [...]

 December 1,2011, Printed Electronics USA 2011, Santa Clara, CA—James Zunino from the U.S. Army RDECOM provided an overview of printed materials capabilities and current prototypes for Army applications. This R&D group partners with many other government, academic, and industry research organizations to expand the military capabilities for printed electronics. This group is in charge if [...]