Friday, May 18th, 2012

Renesas Touts new LTE Chips

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 January 10, 2012, CES, Las Vegas—Renesas Mobile Corp. released a new family of LTE-based platforms for mobile devices. They also showed off a graphics engine.

The SP2531 comprises a highly integrated baseband modem, an RF subsystem containing the RF integrated chip, front end module, a power amplifier and a power management sub-system. The company received an award for innovations in design and engineering in the embedded technologies category at this year's CES for this product. In combination, this reference platform presents a small footprint, low power consumption and high levels of integration. The SP2531 can be developed into different form factors to address multiple markets. The same design can be implemented as a tablet, a smartphone or can be integrated into automotive, M2M or PC applications.

Its triple mode capabilities, which encompass LTE (4G), Dual Carrier HSPA (advanced 3G) and 2G cellular access technologies enable it to work on legacy networks around the world as well as the latest mobile broadband orientated systems. The modem platform enables many different implementations such as; a USB device designed to provide always on connectivity to the nomadic PC market, or a mini-PCIe format to be embedded in tablets, netbooks or similar devices.

The company is releasing the MP5225 triple and dual-mode high-end smartphone platform to provide a game-console-like experience on a mobile phone. It boasts the ability to deliver more than five times the graphics performance of current generation devices, along with the horse-power required to deliver exciting features.

The chips have full reference designs and various platforms for mobile devices. The chips are able to work with any OS and the company demonstrated operation of the graphics engine running on Android 3.0 (Honeycomb) and LTE data calls through the triple-mode modem using Android 4.0 (Ice Cream Sandwich).

The various chips enable companies to design handsets based on proven technology, to save time on testing and compatibility, accelerate time to market and to ensure peace of mind. They integrate graphics and processing capabilities that take advantage of the high-speed broadband capabilities of LTE to deliver a good mobile device experience. They have designed the chip to use the capabilities of Android to deliver new features. And finally, they worked to ensure that the platform can scale to accommodate multiple feature sets and form factors, while delivering the highest possible levels of performance.

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