Saturday, March 25th, 2017

December 2012 – San Francisco, CA – This year the International Electron Device Meeting kicked off with a short course on Circuit and Technology Interaction. Historically, this was held as several sessions in the conference focusing on the new devices for memories, logic and analog operation. With the overall shift to FDSOI and FinFET style [...]

Prof. Hu was recognized for his extended accomplishments for UC Berkeley. Some of his graduate students, who came from all over the world, gathered at the Banatao Auditorium on Thursday, December 13 to celebrate his birthday. They shared the memorable moments of their school years at UC Berkeley with the audience. Among the crowd were [...]

October 2012 – On chipdesign day at the ARM Techcon in Santa Clara, a joint session between Cadence and IBM presented the results of new ARM IP at the 14nm node. The SOI process developed by IBM is an advanced FinFET flow that incorporated an ARM Cortex-M0 processor, SRAM memory blocks and a number of [...]

 July 2012 – At Semicon San Francisco, CEA Leti and their spinoff SOITEC held events to overview their new research and new production capabilities. Both of these groups are focusing on new semiconductor technologies for the mobile marketplace as the drive. The differentiating factors for mobile include: reduced operating voltage, reduced standby and leakage current, [...]

 April 26, 2012, GSA Silicon Summit, Mountain View, CA—Subramani Kengeri from Global Foundries acknowledged a gap between efforts and capabilities in the lab versus those in the fab. To continue working on Moore’s law requires an SOC view and more collaboration. Currently, four areas are driving improvements in silicon; interconnect, lithography, packaging, and silicon technology [...]