September 18, 2012, Memcon, Santa Clara, CA—Scott Graham from Micron offered the hybrid memory cube architecture as a way to address the challenges and memory bottlenecks in high performance systems. The memories and their interfaces are inhibiting the ability for servers to improve throughput performance. Application server performance requires reducing latency for networks, while increasing [...]
May 24, 2012, MEMS Business Forum, Santa Clara, CA—Kurt Petersen from KP_MEMS gave a historical perspective on MEMS. The ability to integrate complex functions into a chip has led to high volumes and lower costs. Starting in ’75, there were pressure sensors, strain gauges, and thermal print heads. Now, the range of applications using MEMS [...]
December 1,2011, Printed Electronics USA 2011, Santa Clara, CA—Michael Londo from MWV Packaging described their efforts to increase packaging security for consumer products. Packaging can deliver benefits to consumers, brand owners, and retailers in the areas of protection, and image while maintaining convenience and sustainability. In the areas of protection, the big box stores lose [...]
July 11, 2011, IMEC technology Forum, San Francisco—Eric Beyne, scientific director advanced packaging at IMEC addressed exploiting the 3rd dimension. Planar technologies and SoCs are running into a wall. The smart phone is the biggest driver for advanced packaging developments. Users want lower power (or equivalently longer battery life) while the designers try to cram [...]
