Wednesday, October 1st, 2014

September 9, 2014, Intel Developer Forum, San Francisco—Pericom announced a broad range of new products at the show. Following the lead of the standards organizations and OEM roadmaps, they are making products that will enhance mobility and interoperability. The emphasis is on low power operation and small packaging for all of the parts. The new [...]

September 9, 2014, Intel Developer Forum, San Francisco—Renesas Showed off their latest USB functions with a pair of chips that enable the USB 3.0 power delivery function. They also showed some production samples of the new type-c connector for the power delivery. The power deliver controller (uPD720250) supports up to 100W (5A at 20V) power [...]

September 9, 2014, Intel Developer Forum, San Francisco—Intel engineers explained and demonstrated some issues facing developers using iA-based mobile and embedded devices in their products. The use of specialized tools helps to identify and manage power and performance issues. The primary tool they advocate is the Intel System Studio which can provide views of CPU, [...]

September 10, 2014, Intel Developer Forum, San Francisco—Graphics specialists from Intel presented some possible optimizations for HD and Iris graphics systems. The growing need for higher performance in graphics units requires better use of the available resources. The need for better performance spans the whole creation, consumption, and playing spectrum. Almost one in five Steam [...]

September 19, 2014, Intel Developer Forum, San Francisco—Geof Findley and Becky Loop provided an overview of the latest developments in memory technologies for high- performance systems. They described the various iA devices and compatibility with the latest DRAM devices and modules. The first platforms to support DDR4 are the Xeon E5-2600 v3 family and Core [...]

September 9, 2014, Intel Developer Forum, San Francisco—The USB promoter group described their efforts on new specification implementations. Now a single cable can deliver high bandwidth and power through a single cable. A new unpolarized connector is smaller than the past type-A connectors and more robust than the mini-connectors currently in phones and mobile devices. [...]

July 7, 2014, IMEC Technology Forum, San Francisco—An Steegen from IMEC described the requirements and readiness of next-generation processes for semiconductors. The production of semiconductors beyond 14nm is going to challenge our existing design and manufacturing flows and will take new devices and technologies to replace out CMOS infrastructure. The general industry directions are for [...]

June 4, 2014, PCI-SIG Devcon, Santa Clara, CA—Al Yanes and Ramin Neshati from the PCI-SIG described the updates, strategy, and roadmap for the PCI systems. The organization is looking at new apps and the technologies to enable those functions. The organization is growing and has a good financial status. The emergence of IoT as a [...]

May 2014, Internet of Things Conference, Santa Clara, CA—We talked with Uday Mudoi from Vitesse about the company and their products. They are falling back on their years of experience in Ethernet products to change the company focus. The drivers are in the growing acceptance of FbE in enterprise networks. Although the internals of the [...]

April 30, 2014, Ethernet Technology Summit, Santa Clara, CA—Shahar Feldman from Microsemi addressed the issues of power and heat in Ethernet networks. The standards for power over Ethernet allow for fairly significant levels of power delivery over the same wires as the data and control lines. At issue is the need for heat and thermal [...]