Thursday, March 5th, 2015

July 7, 2014, IMEC Technology Forum, San Francisco—An Steegen from IMEC described the requirements and readiness of next-generation processes for semiconductors. The production of semiconductors beyond 14nm is going to challenge our existing design and manufacturing flows and will take new devices and technologies to replace out CMOS infrastructure. The general industry directions are for [...]

June 4, 2014, PCI-SIG Devcon, Santa Clara, CA—Al Yanes and Ramin Neshati from the PCI-SIG described the updates, strategy, and roadmap for the PCI systems. The organization is looking at new apps and the technologies to enable those functions. The organization is growing and has a good financial status. The emergence of IoT as a [...]

May 2014, Internet of Things Conference, Santa Clara, CA—We talked with Uday Mudoi from Vitesse about the company and their products. They are falling back on their years of experience in Ethernet products to change the company focus. The drivers are in the growing acceptance of FbE in enterprise networks. Although the internals of the [...]

April 30, 2014, Ethernet Technology Summit, Santa Clara, CA—Shahar Feldman from Microsemi addressed the issues of power and heat in Ethernet networks. The standards for power over Ethernet allow for fairly significant levels of power delivery over the same wires as the data and control lines. At issue is the need for heat and thermal [...]

April 29, 2014, Ethernet Technology Summit, Santa Clara, CA—Joel Goergen from Cisco discussed the drives for increasing the data rates for next generation Ethernet systems. The ongoing trends have to be balanced with the constraints of physics and economics to be viable. System interconnect has moved from 20 Mbps in a 2kW chassis to 25 [...]

April 30, 2014, Ethernet Technology Summit, Santa Clara, CA—Mitch Fields from Avago Technologies described the efforts needed to drive costs out of 40/100/400 GbE optical interconnects. One of the biggest impediments to growth in the high-speed Ethernet environment is the cost of the optical interconnects. Optical networks can be incorporated into a system as chip-to-chip, [...]

February 13, 2014, Berkeley EECS Annual Research Symposium, UC-Berkeley, CA—Michel Maharbiz discussed research into interfaces between synthetic and multicellular objects and neural dust. These cyborgs—bugs with computer interfaces—allow researchers to stimulate the brains and control motion. During some of their testing, they found that their bugs had other light sensors in addition to their compound [...]

February 12, 2014, ISSCC, San Francisco—New materials and technologies are starting to move beyond the lab into new applications. The different semiconductor materials are being deposited on many types of substrates and the component libraries are now rich enough to make microprocessors and PROMs and well as display drivers and analog circuits. Kris Myny from [...]

February 11, 2014, ISSCC, San Francisco—Advanced biomedical systems are combining integrated sensors and actuators to offer better data and improved comfort and usability at the point of care. These systems not only help to reduce the cost of healthcare, but enable early diagnosis, personal point of care, and therapy outside of traditional clinical settings. This [...]

February 11, 2014, ISSCC, San Francisco—Mobile devices are growing in complexity and performance while being driven to reduce power to allow for longer battery lives. The challenge in connecting radios, computers, sensors, and other interface circuits calls for very aggressive power management techniques, even in systems with large power budgets like automobiles and smart buildings. [...]