February 18, 2013, ISSCC, San Francisco—Session 6 demonstrated emerging medical and sensor technologies. Contributors included KAIST in Korea, Masdar Institute of Science and Technology in UAE, National Chiao Tung Universtiy and China Medical University and ASE in Taiwan, University of Tokyo in Japan, EDA-LITEN in France, Eindhoven University of Technology in The Netherlands, ST Microelectroincs [...]
November 13, 2012, A. Richard Newton Global Technology Leaders’ Conference, UC Berkeley—Carl Bass from Autodesk presented a view of engineering innovation by design. After a short video, he said that this is the best time to be an engineer. The potential for innovation now meets the access to markets, tools and money. There are three [...]
August 14, 2012, Emerging Display Technology Conference, Santa Clara, CA—G. Rajeswaran form Moser Baer Technologies presented the advances in OLED technology for displays and lighting. The latest technologies have evolved from work starting in the mid ’80s. Kodak started their efforts to make solar cells, but the materials didn’t absorb energy, they emitted light. Along [...]
July 11, 2012, FlexTech Alliance, San Francisco—Shelby Nelson from Eastman Kodak described ongoing experiments with equipment, materials, and process design to create vertical thin-film transistors. Their work is based on a variant of atomic layer deposition that reduces the influence of lithography on device geometries. Their work in ALD has given rise to a spatial [...]
July 11, 2012, FlexTech Alliance, San Francisco—Ritwik Bhatia from Cambridge NanoTech described the details of processing engineered materials in atomic layer granularity. This process allows for the conformal coating of materials on to a substrate a layer of material at a time. Atomic layer deposition is a process that uses a number of precursor materials, [...]
May 23, 2012 – The MEMS Tech Symposium had its theme presentation on the MEMS market reaching the $Trillion mark in the future, from Janusz Bryzek of Fairchild Semi. The presentation focused on the MEMS commercialization cycle and the extension of the current 15% CAGR from the $1.5B base of 2012 to ~$1 trillion by [...]
April 26, 2012, GSA Silicon Summit, Mountain View, CA—Subramani Kengeri from Global Foundries acknowledged a gap between efforts and capabilities in the lab versus those in the fab. To continue working on Moore’s law requires an SOC view and more collaboration. Currently, four areas are driving improvements in silicon; interconnect, lithography, packaging, and silicon technology [...]
December 1,2011, Printed Electronics USA 2011, Santa Clara, CA—Warren Jackson from HP talked about fabricating large area metal oxide thin film transistors (MOTFT) using roll-to-roll imprint lithography. These developments can be applied to many areas including displays, packaging, and civil and military functions. MOTFTs offer many advantages over amorphous silicon and poly-silicon. A-Si has low [...]
December 15, 2011 – San Jose, CA – Renesas Electronics Corp. just announced the availability of their new embedded Flash memory IP for the automotive industry. Supplementing their 90nm process solutions, they have chosen to bypass the 65nm and 55nm nodes and moved directly to a 40nm process. This is a fully qualified automotive process [...]
May 17, 2011, Society for Information Display, Los Angeles—We talked to Takahiro Ikezaki, vp of the electronics flat glass division from Asahi Glass Company about their latest developments. Thin and tough were the key words for the talks. Stress Test on DragonTail glass (Three-point bending with 1.1 mm-thick glass) Their latest cover glass [...]
