July 2012 – At Semicon San Francisco, CEA Leti and their spinoff SOITEC held events to overview their new research and new production capabilities. Both of these groups are focusing on new semiconductor technologies for the mobile marketplace as the drive. The differentiating factors for mobile include: reduced operating voltage, reduced standby and leakage current, [...]

 June 2012 – In a discussion with SOITEC, they discussed thier new 28nm and smaller process offering on 300mm wafers. These larger wafers are in addition to their existing 200mm lines and large geometry processes that were migrated to 300mm in the past. The process offering is targeting designs using fully depleted devices and was [...]