IBM envisions 3-D integration
December 8, 2010, 3-D Architectures for Semiconductor Integration and Packaging conference, Burlingame, CA—the first talk on 3-D directions came from IBM. Subramanian Iyer, fellow from IBM who discussed ” 3D Integration for High Performance System Applications”. Despite advances in scaling, materials, and silicon engineering, the IC performance levels are not improving at historical rates. Now,…