Holiday 2020 One More Headsets

ByPC 11/05/202012/17/2025

For audio enthusiasts several new in-ear headphone products were released by On-More. Their new flagship product is an true wireless product that comes in a USB-C charging case. The product uses the latest Bluetooth technology with the Qualcomm chipset. The new in-ear product has a redesigned acoustic chamber and drivers that now brings full THX certification to the sound. Joining this flagship wireless product is a new wired product that uses a triple driver technology. A short video showing the product follows.

https://vimeo.com/562360815

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A 3-Axis Gyroscope with Continuous Self-Test
ByTets 03/12/2015

February 25, 2015, ISSCC, San Francisco—Ganesh Balachandran from Bosch presented the design of a 3-axis gyroscope for electronic stability control (ESC) with continuous self test. Active and passive control systems are the driver for more functionality and capability within a car and these functions create a need for more sensors. In a car, a gyroscope…

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BYOD Without BYO(In) Security – Cisco
ByTets 03/19/201203/19/2012

February 28, 2012, RSA Conference, San Francisco— Continuing the discussion of BYO Devices into a secure network, Cisco Daniel DeSantos and Nasrin Rezai from Cisco described their Sentry program. Increasing mobility brings new requirements to people, processes, and the ocean of security models. By ’15, there’ll be more than 1 billion wireless devices, and every…

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Maxon at NAB 2013
ByTets 05/09/2013

April 8, 2013, National Association of Broadcasters, Las Vegas—We talked with Maxon about their latest product releases. The main item was their tool integration with Adobe tools. They revealed the strategic alliance with Adobe, aimed at delivering a new level of integration between its 3D application CINEMA 4D, and After Effects. Two MAXON technologies will…

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Common Platform – Arm
ByTets 01/24/2011

January 18, 2011, Common Platform Technology Forum, Santa Clara, CA– Mike Muller, CTO at ARM talked about scaling from dimensions of a cubic millimeter to a cubic kilometer. One of the problems with predicting technology changes is that most people get it wrong. An unusual example is someone who got it right. In 1956, and…

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Progress in 3-D IC production
ByTets 01/06/2011

December 9, 2010, 3-D Architectures for Semiconductor Integration and Packaging conference, Burlingame, CA— Bob Patti, CTO at Tezzaron Semiconductor illustrated the changes in complexity when changing from wafer-level to 3-D integration. The span of interconnect densities goes from 100 to 1 million connections per square mm and may total from 1000’s to tens of millions….

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Eureka & new innovation at CES 2013 – part 2
ByPC 02/12/201302/12/2013

January 2013 – The main convention center at LVCC is filled with establish companies with well known product lines. The new expansion at the Venetian hotel and the upper floor exhibit areas featured smaller and emerging companies that were bringing out new technology for the first time or as prototypes to the CES show. Some…

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