December 15, 2014, IEDM, San Francisco—Enrico Prati from Consiglio Nazionale delle Ricerche talked about atomic scale devices and the potential for 3-D atomic printers. The driver of Moore’s Law and the progressions of molecular-scale processing begs the question of the possibility for atomic-scale devices and the mechanisms to enable their creation. Over time, normal functions…
December 9, 2010, 3-D Architectures for Semiconductor Integration and Packaging conference, Burlingame, CA—Jan Vardaman, president of TechSearch International talked about the issues in getting TSVs into high volume production. Many areas are getting past the power point levels and approaching full production status. Memories, wireless, and high-speed logic ( FPGA) are all looking into 3-D…
In order to address the growing need for computing and electronic processing in portable and high functionality design, TSMC, the worlds largest independent semiconductor manufacturing foundry, released their reference flow 11 for 28nm/22nm processes. The technology driver for these processes has shifted from the historic memory designs, and then processors, to the current System-On-a-Chip (SOC)…