July 2015 – The next generation of mobile devices and notebooks are moving to a thinner form factor. This thinner body design is the driving force behind the rapid adoption of the new USB type C connector which is reversible plug/ receptacle providing multi-function single cable solution for the USB 3.x interface. The interface is…
September 2013 – At IDF 2013 in San Francisco, Pericom was showing their new high performance redriver chips that are enabling both the large format CE devices/Network devices and the active cable/expander marketplace. One of the themes at IDF this year were higher bandwidths for connectivity. The increase in images, video and other long run…
September 2011 – The new processors and chipset systems shown at Intel Developer Forum, now support a number of high speed (around and near 5Gbps) interfaces. These connections – HDMI, Display Port (DP), USB 3.0, PCIe Gen 3, and Thunderbolt all operate a low power (3.3 and dual 3.3v/1.5v) from the main chipset for the…