3-D IC panel – CICC
September 20, 2011, CICC, San Jose, CA—A panel moderated by Rao Tummala from Georgia Tech considered the issue of MCMs (multi-chip-modules) possibly delaying 3-D IC developments. Heterogeneous integration techniques of multiple ICs like SIP, wire-bonded stacked die, and silicon carriers offer an alternative to 3-D ICs with TSVs. Tummala noted that MCM technology is over…