January 5, 2011, Storage Visions, Las Vegas — digital storage is becoming crucial to product design in consumer electronics. The panel comprised of moderator Guy Finley from Media and Entertainment Services Alliance, Dave Reinsel from IDC, Ho Seong Lee from Samsung Electronics, Tony Kim from Samsung Semiconductor, Kishore Rao from Intel, Robert Pierce from Cadence…
January 4, 2011, Storage Visions, Las Vegas—an Intel-sponsored panel looked at new storage architectures for mobile devices. Melissa Perenson from PC World was the moderator. The panel consisted of Troy Winslow from Intel, Luke Choi from Hitachi data storage, Kevin silver from NVELO, Conrad Maxwell fro SATA-IO and Silicon Image, and Doreet Oren from SanDisk….
December 8, 2010, 3-D Architectures for Semiconductor Integration and Packaging conference, Burlingame, CA—the first talk on 3-D directions came from IBM. Subramanian Iyer, fellow from IBM who discussed ” 3D Integration for High Performance System Applications”. Despite advances in scaling, materials, and silicon engineering, the IC performance levels are not improving at historical rates. Now,…
September, 13, 2010, Intel Developer Forum San Francisco—the Serial ATA International Organization released the Serial ATA Revision 3.1 Specification. SATA 3.1 enables new capabilities and functions within the interface. This latest revision enables 6Gb/s link speeds between storage units, disk drives, optical and tape drives and protocol host bus adaptors (HBAs). At the same time,…
September 1. 2010, Global Technology Conference, San Jose, CA, Chekib Akrout, senior vp technology group at AMD described the changes in the industry leading to their efforts at integrating CPU and GPU’s. The industry has come to a point where the dynamics and the technology are now available to integrate two major function blocks into…