Ultra-Thin Flexible CMOS Stress Sensor
February 24, 2015, ISSCC, San Francisco—Yigit Mahsereci from the University of Stuttgart presented work on a hybrid system-in-foil that takes advantage of both thin-film electronics and silicon integration. The combination provides the industry with new capabilities that neither technology can provide alone. The main trick is to thin the silicon to 10-20 um where the…