EDA view on 3-D ICs
December 8, 2010, 3-D Architectures for Semiconductor Integration and Packaging conference, Burlingame, CA—Anton Domic senior vice president at Synopsys started out noting that > 2D integration is already here in the form of stacked die and package on package technologies. There are a number of products in production using these technologies. 3-D IC integration is…