March 14, 2012, Common Platform Technology Forum, Santa Clara, CA—Simon Segars, executive vice president and general manager of the physical IP division of ARM looked at the next generation processes from an IP and developer perspective. The historical technology changes have always been pushing for better performance. Over the past 21 years, the industry has…
At the 2011 3-D Architectures for Semiconductor Integration and Packaging Conference held in San Mateo, CA this month, speaker after speaker made it pretty apparent that 3D is for real. Though there are still competing flavors of 3D, and some advocate ‘2.5D’ as a safe stepping stone, the cost and reliability of 3D are now…
April 26, 2011, Mentor U2U, Santa Clara,CA—Wally Rhines described the dynamics of the design automation industry at the Mentor users’ group meeting. The EDA industry has fairly unique characteristics as a marketplace that seem to defy description and analysis. Mentor is growing and approaching $1B in total revenues. Some ask if EDA tracks industries like…
December 8, 2010, 3-D Architectures for Semiconductor Integration and Packaging conference, Burlingame, CA—Anton Domic senior vice president at Synopsys started out noting that > 2D integration is already here in the form of stacked die and package on package technologies. There are a number of products in production using these technologies. 3-D IC integration is…