3-D CMOS Image Sensor and A/D Converters by Direct Bonding
December 15, 2014, IEDM, San Francisco—Masahide Goto from NHK Science and Technology Research Laboratories described work on a pixel-parallel detector and A-D converter on bonded SOI wafers. The test device changes the underlying architecture to handle the need for increased data processing and higher resolution. The detector is focused on the high dynamic range, high…


